SILICONE RESIN REFLECTIVE SUBSTRATE, MANUFACTURING METHOD FOR SAME, AND BASE MATERIAL COMPOSITION USED IN REFLECTIVE SUBSTRATE

• Main Authors: Igarashi, Naoto, Tasaki, Masutsugu, Ichikawa, Akira, Yoshida, Maimi, Odaki, Tsutomu
• Format: Patent
• Language: English; French; German
• Published: 29.05.2019
• Subjects: ADHESIVES; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING; BASIC ELECTRIC ELEMENTS; BLASTING; CHEMICAL PAINT OR INK REMOVERS; CHEMISTRY; COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; CORRECTING FLUIDS; DYES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FILLING PASTES; FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMSTHEREOF; HEATING; INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES; INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS; INKS; LIGHTING; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; MECHANICAL ENGINEERING; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; PERFORMING OPERATIONS; POLISHES; PREPARATION OF CARBON BLACK; SEMICONDUCTOR DEVICES; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR; SHAPING OR JOINING OF PLASTICS; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHERARTICLES, NOT OTHERWISE PROVIDED FOR; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS,TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; USE OF MATERIALS THEREFOR; WEAPONS; WOODSTAINS; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Disclosed is a versatile silicone resin reflective substrate which exhibits high reflectance of high luminance light from an LED light source over a wide wavelength from short wavelengths of approximately 340 - 500nm, which include wavelengths from 380 - 400nm near lower limit of the visible region, to longer wavelength in the infra-red region. The silicone resin reflective substrate also exhibits superior thermal conductivity, light fastness, heat resistance, weather resistance, and flame resistance without deterioration such as yellowing caused over time by the irradiation of the high luminance light. The silicone resin reflective substrate further exhibits mechanical and chemical stability, the ability to maintain a white color over a long period of time, and superior adhesion to metals and resins. The silicone resin reflective substrate can be easily formed as a wiring substrate, a packaging case or the like, and can be manufactured at low cost and a high rate of production.The silicone resin reflective substrate (10 * 20) has a reflective layer which contains a white inorganic filler powder (12a * 12b) dispersed in a three-dimensional cross linked silicone resin, the inorganic filler powder having a high reflective index than the silicone resin. The reflective layer is formed on a support body as a film, a solid, or a sheet.