WIRELESS MODULE WITH ANTENNA PACKAGE AND CAP PACKAGE

• Main Authors: DALMIA, Sidharth, KUSHNIR, Igal Yehuda
• Format: Patent
• Language: English; French; German
• Published: 18.08.2021
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

Wireless modules having a semiconductor package attached to an antenna package and cap package are disclosed. The semiconductor package may have one or more electronic components disposed thereon. The antenna package may be communicatively coupled to the semiconductor package using by one or more co...