POROUS POLISHING TOOL AND POLISHING TOOL INCLUDING SAME

• Main Authors: FUJIWARA, Norimasa, MURAI, Keiichi
• Format: Patent
• Language: English; French; German
• Published: 10.01.2024
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; GENERAL PROCESSES OF COMPOUNDING; GRINDING; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; POLISHING; THEIR PREPARATION OR CHEMICAL WORKING-UP; TOOLS FOR GRINDING, BUFFING, OR SHARPENING; TRANSPORTING; WORKING-UP

An object of the present invention is to provide a porous material for polishing in which, during a polishing operation, it is possible to keep a proportion between abrasive grains in contact with an object to be polished and a resin portion in contact with the object to be polished within a certain...