FABRICATION OF OPTICS WAFER

• Main Author: RUDMANN, Hartmut
• Format: Patent
• Language: English; French; German
• Published: 14.10.2020
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; PERFORMING OPERATIONS; PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCESIN A PLASTIC STATE; SEMICONDUCTOR DEVICES; TRANSPORTING; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Fabricating an optics wafer includes providing a wafer (8) comprising a core region (9) composed of a glass-reinforced epoxy, the wafer (8) further comprising a first resin layer (10A) on a top surface of the core region (9) and a second resin layer (10B) on a bottom surface of the core region (9). The core region (9) and first and second resin layers (10A,10B) are substantially non-transparent for a specific range of the electromagnetic spectrum. The wafer (8) further includes vertical transparent regions (6) that extend through the core region (9) and the first and second resin layers (10A,10B) and are composed of a material that is substantially transparent for the specific range of the electromagnetic spectrum. The wafer (8) is thinned, for example by polishing, from its top surface and its bottom surface so that a resulting thickness is within a predetermined range without causing glass fibers of the core region (9) to become exposed. Respective optical structures are provided on one or more exposed surfaces of at least some of the transparent regions (6).