TUNGSTEN-PROCESSING SLURRY WITH CATIONIC SURFACTANT

Described are chemical mechanical polishing compositions and methods of using the compositions for planarizing a surface of a substrate that contains tungsten, the compositions containing silica abrasive particles and cationic surfactant.

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Bibliographic Details
Main Authors FU, Lin, HUANG, Helin, DOCKERY, Kevin
Format Patent
LanguageEnglish
French
German
Published 19.06.2019
Subjects
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Abstract Described are chemical mechanical polishing compositions and methods of using the compositions for planarizing a surface of a substrate that contains tungsten, the compositions containing silica abrasive particles and cationic surfactant.
AbstractList Described are chemical mechanical polishing compositions and methods of using the compositions for planarizing a surface of a substrate that contains tungsten, the compositions containing silica abrasive particles and cationic surfactant.
Author DOCKERY, Kevin
FU, Lin
HUANG, Helin
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DocumentTitleAlternate WOLFRAMVERARBEITENDE SUSPENSION MIT KATIONISCHEM TENSID
TRAITEMENT DE LA BOUE AU TUNGSTÈNE AVEC UN TENSIOACTIF CATIONIQUE
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RelatedCompanies Cabot Microelectronics Corporation
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Snippet Described are chemical mechanical polishing compositions and methods of using the compositions for planarizing a surface of a substrate that contains tungsten,...
SourceID epo
SourceType Open Access Repository
SubjectTerms ADHESIVES
BASIC ELECTRIC ELEMENTS
CHEMISTRY
DYES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
PAINTS
POLISHES
POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH
SEMICONDUCTOR DEVICES
SKI WAXES
Title TUNGSTEN-PROCESSING SLURRY WITH CATIONIC SURFACTANT
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