TUNGSTEN-PROCESSING SLURRY WITH CATIONIC SURFACTANT
Described are chemical mechanical polishing compositions and methods of using the compositions for planarizing a surface of a substrate that contains tungsten, the compositions containing silica abrasive particles and cationic surfactant.
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Main Authors | , , |
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Format | Patent |
Language | English French German |
Published |
19.06.2019
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Online Access | Get full text |
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Abstract | Described are chemical mechanical polishing compositions and methods of using the compositions for planarizing a surface of a substrate that contains tungsten, the compositions containing silica abrasive particles and cationic surfactant. |
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AbstractList | Described are chemical mechanical polishing compositions and methods of using the compositions for planarizing a surface of a substrate that contains tungsten, the compositions containing silica abrasive particles and cationic surfactant. |
Author | DOCKERY, Kevin FU, Lin HUANG, Helin |
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Discipline | Medicine Chemistry Sciences |
DocumentTitleAlternate | WOLFRAMVERARBEITENDE SUSPENSION MIT KATIONISCHEM TENSID TRAITEMENT DE LA BOUE AU TUNGSTÈNE AVEC UN TENSIOACTIF CATIONIQUE |
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PublicationYear | 2019 |
RelatedCompanies | Cabot Microelectronics Corporation |
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Snippet | Described are chemical mechanical polishing compositions and methods of using the compositions for planarizing a surface of a substrate that contains tungsten,... |
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SubjectTerms | ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS POLISHES POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH SEMICONDUCTOR DEVICES SKI WAXES |
Title | TUNGSTEN-PROCESSING SLURRY WITH CATIONIC SURFACTANT |
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