ZIPPER TAPE, BAG WITH ZIPPER TAPE, METHOD FOR MANUFACTURING BAG WITH ZIPPER TAPE

• Main Authors: KAKIGAMI Koji, KATADA Ryo, GOTO Shuichi, NAMBA Yoshinori
• Format: Patent
• Language: English; French; German
• Published: 08.11.2023
• Subjects: ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING; CLADDING OR PLATING BY SOLDERING OR WELDING; CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS,e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES,DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; CONVEYING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; HANDLING THIN OR FILAMENTARY MATERIAL; MACHINE TOOLS; MAKING ARTICLES OF PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNERANALOGOUS TO PAPER; MAKING CONTAINERS OF PAPER, CARDBOARD OR MATERIAL WORKED IN AMANNER ANALOGOUS TO PAPER; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PACKAGES; PACKAGING ELEMENTS; PACKING; PERFORMING OPERATIONS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR; SHAPING OR JOINING OF PLASTICS; SOLDERING OR UNSOLDERING; STORING; TRANSPORTING; WELDING; WORKING BY LASER BEAM; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL; WORKING PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNER ANALOGOUSTO PAPER

On a band-shaped male-side base (211A) on which a male part (212) is integrally provided and a female-side base (221A) on which a female part (222) is integrally provided, a light-absorbing layer (23) and a bonding layer (24) are laminated on the surface opposite to the surface on which the male part (212) or the female part (222) is provided. The light-absorbing layer (23) contains a light-absorbing material that absorbs laser light with a wavelength absorption region of 800 nm to 1200 nm. The bonding layer (24) contains a metallocene straight chain low density polyethylene, which is a low melting point resin with a melting point of 60°C to 120°C. When bonding the zipper tape (20) to a substrate film (11), the light-absorbing layer (23) is heated by irradiating laser light and the bonding layer (24) melts. The melted bonding layer (24) is pressed on the substrate film (11) and bonded. Bonding without thermal degradation of the substrate film (11) is possible.