SURFACE MOUNT PACKAGING FOR HIGH-SPEED VERTICAL CAVITY SURFACE EMITTING LASERS

• Main Authors: WATKINS, Laurence, GHOSH, Chuni, SEURIN, Jean F, WANG, Qing
• Format: Patent
• Language: English; French; German
• Published: 13.12.2017
• Subjects: BASIC ELECTRIC ELEMENTS; DEVICES USING STIMULATED EMISSION; ELECTRICITY

An optical illuminator module comprises: a) a plurality of Vertical Cavity Surface Emitting Lasers (VCSELs) (202, 302) forming a two-dimensional array (111, 209, 309, 409, 509, 609, 709) constructed on a common substrate (97, 101, 112, 201, 301, 701, 1301, 1401, 5101, 1601, 1701) having a bottom surface comprising a bottom contact forming a first terminal of the two-dimensional array and a top surface comprising a top contact forming a second terminal of the two-dimensional array, the plurality of VCSELs generating an optical output beam (114, 308) that propagates from the top surface of the common substrate (97, 101, 112, 201, 301, 701, 1301, 1401, 5101, 1601, 1701); and b) a submount (113, 203, 303, 403, 703, 803, 903, 1103, 2001) having a first surface comprising a plurality of bonding pads (204, 205, 304, 305, 404, 504, 505, 604, 605, 704, 1104, 1105, 2003, 2004) electrically isolated from each other and a second surface that is opposite the first surface, the second surface comprising a plurality of bonding pads (214, 215, 314, 315, 415, 418, 514, 515, 518, 614, 630, 1115, 2003, 2004) electrically isolated from each other. A respective one of the plurality of bonding pads (204, 205, 304, 305, 404, 504, 505, 604, 605, 704, 1104, 1105, 2003, 2004) on the first surface is electrically connected to a respective one of the plurality of bonding pads (214, 215, 314, 315, 415, 418, 514, 515, 518, 614, 630, 1115, 2003, 2004) on the second surface with a plurality of via holes (311, 411, 511, 611, 1111, 2005). The bottom contact is electrically connected to a first one of the plurality of bonding pads (204, 205, 304, 305, 404, 504, 505, 604, 605, 704, 1104, 1105, 2003, 2004) on the first surface of the submount (113, 203, 303, 403, 703, 803, 903, 1103, 2001) such that the two-dimensional array is in thermal contact with the submount (113, 203, 303, 403, 703, 803, 903, 1103, 2001) and the top contact is electrically connected to a second one of the plurality of bonding pads (214, 215, 314, 315, 415, 418, 514, 515, 518, 614, 630, 1115, 2003, 2004) on the first surface.