SPLITTING OF THICK HARD FOAM PANELS

The present invention relates to a method for cutting rigid foams, especially slabstock P(M)I foams. A method is provided here, by means of which it is possible to cut these rigid foams even in relatively high layer thicknesses of, for example, more than 3 mm, without material loss, which is produce...

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Bibliographic Details
Main Authors BERNHARD, Kay, BECKER, Florian, DENK, Tim, RICHTER, Thomas, SCHMIDT, Ulrich, GOLDMANN, Felix, HEMPLER, Mathias
Format Patent
LanguageEnglish
French
German
Published 14.10.2020
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Summary:The present invention relates to a method for cutting rigid foams, especially slabstock P(M)I foams. A method is provided here, by means of which it is possible to cut these rigid foams even in relatively high layer thicknesses of, for example, more than 3 mm, without material loss, which is produced in relevant amounts, for example, in the course of sawing as a result of the sawdust formed.
Bibliography:Application Number: EP20150794853