PROCESS FOR MOULDING A THERMOSETTING RESIN

• Main Authors: TECHER, Marc-Emmanuel, JAUSSAUD, Raoul
• Format: Patent
• Language: English; French; German
• Published: 25.07.2018
• Subjects: AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING; INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS; PERFORMING OPERATIONS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR; SHAPING OR JOINING OF PLASTICS; TRANSPORTING; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

A method of molding a thermosetting resin, in particular of the epoxy resin type, in which a first mold is filled with the resin while causing the temperature of the resin to vary in application of a first temperature program, without exceeding the Tg of the resin. After the first mold has been filled, the resin is put under pressure while causing the temperature of the resin to vary in application of a second temperature program, without exceeding Tg, and a drop in the pressure exerted by the resin on the mold is detected with the instant at which this pressure presents a break of slope being identified as the instant t1. A second mold is filled with the thermosetting resin in application of the first temperature program. After the second mold has been filled, the resin is put under pressure in application of the second temperature program until an instant t2 close to t1. As from t2, the temperature of the resin is increased to exceed Tg.