MULTI-AXIS MAGNETO-RESISTANCE SENSOR PACKAGE

A system and method for providing a position and orientation sensor package having a reduced size in at least one dimension is disclosed. The position and orientation sensor package includes a dielectric substrate and a first magneto-resistance sensor chip attached to the dielectric substrate, the f...

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Bibliographic Details
Main Authors NAGARKAR, Kaustubh Ravindra, LORRAINE, Peter William
Format Patent
LanguageEnglish
French
German
Published 08.03.2017
Subjects
MEASURING
MEASURING ELECTRIC VARIABLES
MEASURING MAGNETIC VARIABLES
PHYSICS
TESTING
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Summary:A system and method for providing a position and orientation sensor package having a reduced size in at least one dimension is disclosed. The position and orientation sensor package includes a dielectric substrate and a first magneto-resistance sensor chip attached to the dielectric substrate, the first magneto-resistance sensor chip including at least one magneto-resistance sensor circuit. The position and orientation sensor package also includes a second magneto-resistance sensor chip attached to the dielectric substrate and positioned adjacent the first magneto-resistance sensor chip, the second magneto-resistance sensor chip including at least one magneto-resistance sensor circuit. The position and orientation sensor package is constructed such that the at least one magneto-resistance sensor circuit of the first magneto-resistance sensor chip is oriented in a different direction than the at least one magneto-resistance sensor circuit of the second magneto-resistance sensor chip.
Bibliography:Application Number: EP20160184430