ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF

• Main Authors: Ji, Yan-Liang, Lin, Cheng-Hua, Chiang, Puo-Yu
• Format: Patent
• Language: English; French; German
• Published: 15.02.2017
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The electronic component includes a semiconductor substrate, a first doped region, a second doped region, a gate structure, a dielectric layer and a conductive portion. The semiconductor substrate has an upper surface. first doped region embedded in the semiconductor substrate. The second doped regi...