INTEGRATED CIRCUIT PACKAGING TECHNIQUES AND CONFIGURATIONS FOR SMALL FORM-FACTOR OR WEARABLE DEVICES

• Main Authors: CHEAH, Bok, Eng, KONG, Jackson, Chung, Peng, OOI, Kooi, Chi, PERIAMAN, Shanggar, SKINNER, Michael, P
• Format: Patent
• Language: English; French; German
• Published: 24.05.2017
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

Embodiments of the present disclosure are directed toward integrated circuit (IC) packaging techniques and configurations for small form-factor or wearable devices. In one embodiment, an apparatus may include a substrate having a first side and a second side disposed opposite to the first side and a...