INTEGRATED ELECTRONIC COMPONENTS AND METHODS OF FORMATION THEREOF
Provided are integrated electronic components which include a waveguide microstructure formed by a sequential build process and an electronic device, and methods of forming such integrated electronic components. The microstructures have particular applicability to devices for transmitting electromag...
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Main Authors | , |
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Format | Patent |
Language | English French German |
Published |
28.12.2016
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Subjects | |
Online Access | Get full text |
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Summary: | Provided are integrated electronic components which include a waveguide microstructure formed by a sequential build process and an electronic device, and methods of forming such integrated electronic components. The microstructures have particular applicability to devices for transmitting electromagnetic energy and other electronic signals. |
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Bibliography: | Application Number: EP20160177859 |