METHOD OF PROVIDING A VIA HOLE AND ROUTING STRUCTURE

• Main Authors: EBEFORS, THORBJÖRN, PERTTU, DANIEL
• Format: Patent
• Language: English; French; German
• Published: 04.02.2015
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

A method of providing a via hole and routing structure includes: providing a substrate wafer having recesses and blind holes provided in the surface of the wafer; providing an insulating layer in the recesses and holes; metallizing the holes and recesses; and removing the oxide layer in the bottom o...