SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

• Main Author: SOYANO, Shin
• Format: Patent
• Language: English; French; German
• Published: 22.01.2020
• Subjects: APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC,OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWERSUPPLY SYSTEMS; BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CONTROL OR REGULATION THEREOF; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUTPOWER; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERATION; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

To improve noiseproof performance. A semiconductor device (1) includes a circuit substrate (10), an enclosing case (20), and a metal part (30). A control circuit (11) is mounted on the front surface of the circuit substrate (10). The enclosing case (20) is a resin case in which semiconductor elements (23) are installed. The metal part (30), included inside the enclosing case (20), includes a first mounting portion (31a), a second mounting portion (32a), and a bus bar (33a). The first mounting portion (31a) mounts the circuit substrate (10) on the enclosing case (20), and is connected to a ground pattern of the circuit substrate (10) when mounting. The second mounting portion (32a) mounts an external instrument (4) on the enclosing case (20), and is grounded when mounting. The bus bar (33a) connects the first mounting portion (31a) and second mounting portion (32a).