Self-limiting etching method with multiple levels

The method involves forming (410) a protective mask i.e. hard mask (230), covering masked areas of a face of a substrate and defining an intermediate space. A plasma etching of relief patterns (110) is performed (420) in a chamber to form inclined flanks from the masked areas on the space by forming...

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Bibliographic Details
Main Authors Gourgon, Cécile, Chevolleau, Thierry, Darnon, Maxime, Desplats, Olivier
Format Patent
LanguageEnglish
French
German
Published 18.11.2020
Subjects
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