Self-limiting etching method with multiple levels
The method involves forming (410) a protective mask i.e. hard mask (230), covering masked areas of a face of a substrate and defining an intermediate space. A plasma etching of relief patterns (110) is performed (420) in a chamber to form inclined flanks from the masked areas on the space by forming...
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Main Authors | , , , |
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Format | Patent |
Language | English French German |
Published |
18.11.2020
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Subjects | |
Online Access | Get full text |
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