Self-limiting etching method with multiple levels

The method involves forming (410) a protective mask i.e. hard mask (230), covering masked areas of a face of a substrate and defining an intermediate space. A plasma etching of relief patterns (110) is performed (420) in a chamber to form inclined flanks from the masked areas on the space by forming...

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Main Authors Gourgon, Cécile, Chevolleau, Thierry, Darnon, Maxime, Desplats, Olivier
Format Patent
LanguageEnglish
French
German
Published 18.11.2020
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Abstract The method involves forming (410) a protective mask i.e. hard mask (230), covering masked areas of a face of a substrate and defining an intermediate space. A plasma etching of relief patterns (110) is performed (420) in a chamber to form inclined flanks from the masked areas on the space by forming a continuous passivation layer (440) on the inclined flanks to produce auto limitation of the etching when the inclined flanks join each other. An additional gas to the plasma is introduced into the chamber, where the gas has molecules of a chemical species participating in formation of the layer.
AbstractList The method involves forming (410) a protective mask i.e. hard mask (230), covering masked areas of a face of a substrate and defining an intermediate space. A plasma etching of relief patterns (110) is performed (420) in a chamber to form inclined flanks from the masked areas on the space by forming a continuous passivation layer (440) on the inclined flanks to produce auto limitation of the etching when the inclined flanks join each other. An additional gas to the plasma is introduced into the chamber, where the gas has molecules of a chemical species participating in formation of the layer.
Author Darnon, Maxime
Chevolleau, Thierry
Gourgon, Cécile
Desplats, Olivier
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DocumentTitleAlternate Procédé de gravure autolimité à niveaux multiples
Auf mehreren Ebenen selbst beschränkendes Ätzverfahren
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Snippet The method involves forming (410) a protective mask i.e. hard mask (230), covering masked areas of a face of a substrate and defining an intermediate space. A...
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SubjectTerms BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Title Self-limiting etching method with multiple levels
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