Carrier assembly for an instrument cluster
The invention relates to a carrier assembly (1) for carrying an instrument cluster. The carrier assembly (1) comprises a housing (2) for the instrument cluster. The housing (2) consists of several housing portions (2.1, 2.2, 2.3) arranged side by side, with every two adjacent housing portions (2.1,...
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Main Authors | , , , , |
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Format | Patent |
Language | English French German |
Published |
25.12.2013
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Subjects | |
Online Access | Get full text |
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Abstract | The invention relates to a carrier assembly (1) for carrying an instrument cluster. The carrier assembly (1) comprises a housing (2) for the instrument cluster. The housing (2) consists of several housing portions (2.1, 2.2, 2.3) arranged side by side, with every two adjacent housing portions (2.1, 2.2, 2.3) linked flexibly to one another by at least one hinge (3). The carrier assembly (1) further comprises for each of said housing portions (2.1, 2.2, 2.3) a printed circuit board (9.1, 9.2, 9.3) fixed to the back side of the housing portion (2.1, 2.2, 2.3), with every two adjacent printed circuit boards (9.1, 9.2, 9.3) linked flexibly by at least one flexible printed circuit (10.1, 10.2). The hinges (3) and the flexible printed circuits (10.1, 10.2) are designed in such a way that every two adjacent housing portions (2.1, 2.2, 2.3) are tiltable with respect to each other around a tilt axis (4.1, 4.2). |
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AbstractList | The invention relates to a carrier assembly (1) for carrying an instrument cluster. The carrier assembly (1) comprises a housing (2) for the instrument cluster. The housing (2) consists of several housing portions (2.1, 2.2, 2.3) arranged side by side, with every two adjacent housing portions (2.1, 2.2, 2.3) linked flexibly to one another by at least one hinge (3). The carrier assembly (1) further comprises for each of said housing portions (2.1, 2.2, 2.3) a printed circuit board (9.1, 9.2, 9.3) fixed to the back side of the housing portion (2.1, 2.2, 2.3), with every two adjacent printed circuit boards (9.1, 9.2, 9.3) linked flexibly by at least one flexible printed circuit (10.1, 10.2). The hinges (3) and the flexible printed circuits (10.1, 10.2) are designed in such a way that every two adjacent housing portions (2.1, 2.2, 2.3) are tiltable with respect to each other around a tilt axis (4.1, 4.2). |
Author | MACQUET, ERIC LEGER, NICOLAS MARTY, SYLVAIN YANKULOV, YORDAN SPASOV SCURI, OLIVIER |
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Discipline | Medicine Chemistry Sciences |
DocumentTitleAlternate | Ensemble support pour groupe d'instruments Trägeranordnung für ein Instrumentenbündel |
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Notes | Application Number: EP20120172613 |
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RelatedCompanies | JOHNSON CONTROLS AUTOMOTIVE ELECTRONICS SAS |
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Snippet | The invention relates to a carrier assembly (1) for carrying an instrument cluster. The carrier assembly (1) comprises a housing (2) for the instrument... |
SourceID | epo |
SourceType | Open Access Repository |
SubjectTerms | ARRANGEMENT OR MOUNTING OF PLURAL DIVERSE PRIME-MOVERS INVEHICLES ARRANGEMENT OR MOUNTING OF PROPULSION UNITS OR OFTRANSMISSIONS IN VEHICLES ARRANGEMENTS IN CONNECTION WITH COOLING, AIR INTAKE, GASEXHAUST OR FUEL SUPPLY OF PROPULSION UNITS, IN VEHICLES AUXILIARY DRIVES FOR VEHICLES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INSTRUMENTATION OR DASHBOARDS FOR VEHICLES MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS TRANSPORTING VEHICLES IN GENERAL |
Title | Carrier assembly for an instrument cluster |
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