IMAGE PICKUP DEVICE AND IMAGE-PICKUP DEVICE MODULE

A image pickup device includes a wiring substrate and an image pickup device. A wiring substrate includes an insulating substrate and a plurality of connection electrodes. The insulating substrate has a penetrating hole, and has an inclined area where its lower surface is inclined downward toward th...

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Bibliographic Details
Main Authors ICHIKI, Shinji, SEGAWA, Hiroyuki
Format Patent
LanguageEnglish
French
German
Published 01.05.2013
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC COMMUNICATION TECHNIQUE
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PICTORIAL COMMUNICATION, e.g. TELEVISION
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Summary:A image pickup device includes a wiring substrate and an image pickup device. A wiring substrate includes an insulating substrate and a plurality of connection electrodes. The insulating substrate has a penetrating hole, and has an inclined area where its lower surface is inclined downward toward the opening. The plurality of connection electrodes are disposed in a surrounding region around the penetrating hole on the lower surface of the insulating substrate, and are to be electrically connected to an image sensor. The image pickup device is mounted on the lower surface of the insulating substrate of the wiring substrate, and is electrically connected to the plurality of connection electrodes.
Bibliography:Application Number: EP20110800842