Polyamide Resin Composition

• Main Authors: Lee, Sang Hwa, Lim, Jong Cheol, Shim, In Sik, Baek, In Geol, Kim, Pil Ho
• Format: Patent
• Language: English; French; German
• Published: 01.02.2017
• Subjects: CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

A polyamide resin composition according to the present invention comprises (A) 10 to 70 % by weight of crystalline polyamide resin, (B) 10 to 70 % by weight of amorphous polyamide resin with a glass transition temperature of 110 to 200 °C, (C) 10 to 60 % by weight of inorganic filler, (D) 10 to 50 %...