Polyamide Resin Composition
A polyamide resin composition according to the present invention comprises (A) 10 to 70 % by weight of crystalline polyamide resin, (B) 10 to 70 % by weight of amorphous polyamide resin with a glass transition temperature of 110 to 200 °C, (C) 10 to 60 % by weight of inorganic filler, (D) 10 to 50 %...
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| Main Authors | , , , , |
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| Format | Patent |
| Language | English French German |
| Published |
01.02.2017
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| Subjects | |
| Online Access | Get full text |
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| Abstract | A polyamide resin composition according to the present invention comprises (A) 10 to 70 % by weight of crystalline polyamide resin, (B) 10 to 70 % by weight of amorphous polyamide resin with a glass transition temperature of 110 to 200 °C, (C) 10 to 60 % by weight of inorganic filler, (D) 10 to 50 % by weight of white pigment, and (E) 0.05 to 2 parts by weight of light stabilizer, based on 100 parts by weight of the crystalline polyamide resin (A), the amorphous polyamide resin (B), the inorganic filler (C) and the white pigment (D), and can have excellent surface reflectance, heat resistance, mechanical strength, moldability, light stability and discoloration resistance. |
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| AbstractList | A polyamide resin composition according to the present invention comprises (A) 10 to 70 % by weight of crystalline polyamide resin, (B) 10 to 70 % by weight of amorphous polyamide resin with a glass transition temperature of 110 to 200 °C, (C) 10 to 60 % by weight of inorganic filler, (D) 10 to 50 % by weight of white pigment, and (E) 0.05 to 2 parts by weight of light stabilizer, based on 100 parts by weight of the crystalline polyamide resin (A), the amorphous polyamide resin (B), the inorganic filler (C) and the white pigment (D), and can have excellent surface reflectance, heat resistance, mechanical strength, moldability, light stability and discoloration resistance. |
| Author | Baek, In Geol Lim, Jong Cheol Shim, In Sik Lee, Sang Hwa Kim, Pil Ho |
| Author_xml | – fullname: Lee, Sang Hwa – fullname: Lim, Jong Cheol – fullname: Shim, In Sik – fullname: Baek, In Geol – fullname: Kim, Pil Ho |
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| DocumentTitleAlternate | Composition de résine polyamide Polyamidharzzusammensetzung |
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| Notes | Application Number: EP20110195781 |
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| RelatedCompanies | Cheil Industries Inc |
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| Snippet | A polyamide resin composition according to the present invention comprises (A) 10 to 70 % by weight of crystalline polyamide resin, (B) 10 to 70 % by weight of... |
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| SubjectTerms | CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS |
| Title | Polyamide Resin Composition |
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