RESIN COMPOSITION

• Main Authors: OKADA, TAKUYA, GOTO, YOSHITSUGU, HIYAMA, SHIGEO, WATANABE, JUN
• Format: Patent
• Language: English; French; German
• Published: 06.04.2011
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; SEMICONDUCTOR DEVICES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

Disclosed is a resin composition having an excellent balance between shortness of curing time and longness of pot life. The resin composition contains (A) an organopolysiloxane having an alkenyl group, (B) an organopolysiloxane having a silicon atom-bonded hydrogen atom, (C) a hydrosilylation catalyst, (D) a silane coupling agent and (E) an unsaturated dicarboxylic acid ester. The component (B) contains (B-1) an organopolysiloxane having a molecular weight of not less than 5,000 but not more than 50,000 and (B-2) an organopolysiloxane having a molecular weight of not less than 100 but not more than 5,000, and the ratio of (B-2) to (B-1) is preferably not less than 0.01% by mass but not more than 20% by mass.