BONDING OF HEAT-ACTIVATED FILMS INCLUDING A PLASTICIZER

Articles including a polymer film, a plasticizer and a substrate are included. A method of bonding the film to the substrate includes the use of the plasticizer which provides a durable bond by using a lower temperatures and shorter bonding times than would be required in the absence of the plastici...

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Bibliographic Details
Main Authors COVELLI, CARMEN, A, FARMER, DOUGLAS, K, MASTERS, GAVIN, N
Format Patent
LanguageEnglish
French
German
Published 04.01.2012
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Summary:Articles including a polymer film, a plasticizer and a substrate are included. A method of bonding the film to the substrate includes the use of the plasticizer which provides a durable bond by using a lower temperatures and shorter bonding times than would be required in the absence of the plasticizer.
Bibliography:Application Number: EP20080849069