A STRUCTURE AND MANUFACTURING METHOD OF METAL WIRING ON MULTILAYERED BOARD

Disclosed is a manufacturing method of metal structure in multi-layer substrate and structure thereof. The manufacturing method of the present invention comprises following steps: coating at least one photoresist layer on a surface of a dielectric layer, and then exposing the photoresist dielectric...

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Bibliographic Details
Main Author YANG, Chih-Kuang
Format Patent
LanguageEnglish
French
German
Published 22.05.2019
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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