Multi-layer polishing pad material for CMP

The invention is directed to a polishing pad for chemical-mechanical polishing comprising an optically transmissive multi-layer polishing pad material, wherein the optically transmissive polishing pad material comprises two or more layers that are joined together without the use of an adhesive.

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Bibliographic Details
Main Authors PRASAD, ABANESHWAR, LACY, MICHAEL, S, SEVILLA, ROLAND, K
Format Patent
LanguageEnglish
French
German
Published 18.02.2009
Subjects
DRESSING OR CONDITIONING OF ABRADING SURFACES
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
TOOLS FOR GRINDING, BUFFING, OR SHARPENING
TRANSPORTING
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Abstract The invention is directed to a polishing pad for chemical-mechanical polishing comprising an optically transmissive multi-layer polishing pad material, wherein the optically transmissive polishing pad material comprises two or more layers that are joined together without the use of an adhesive.
AbstractList The invention is directed to a polishing pad for chemical-mechanical polishing comprising an optically transmissive multi-layer polishing pad material, wherein the optically transmissive polishing pad material comprises two or more layers that are joined together without the use of an adhesive.
Author LACY, MICHAEL, S
SEVILLA, ROLAND, K
PRASAD, ABANESHWAR
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DocumentTitleAlternate Matériau à tampon à polir multicouche pour CMP
Mehrschichtiges Schwabbelscheibenmaterial für CMP
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Snippet The invention is directed to a polishing pad for chemical-mechanical polishing comprising an optically transmissive multi-layer polishing pad material, wherein...
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SubjectTerms DRESSING OR CONDITIONING OF ABRADING SURFACES
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
TOOLS FOR GRINDING, BUFFING, OR SHARPENING
TRANSPORTING
Title Multi-layer polishing pad material for CMP
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