VAPOR DEPOSITED FILM BY PLASMA CVD METHOD

• Main Authors: KITOU, SATORU, NAKANO, RYUTA, NAKAYAMA, MEGUMI, INAGAKI, HAJIME V, IEKI, TOSHIHIDE V
• Format: Patent
• Language: English; French; German
• Published: 04.08.2010
• Subjects: ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS,e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES,DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; CONVEYING; DIFFUSION TREATMENT OF METALLIC MATERIAL; HANDLING THIN OR FILAMENTARY MATERIAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; PACKAGES; PACKAGING ELEMENTS; PACKING; PERFORMING OPERATIONS; STORING; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; TRANSPORTING

A vapor deposited film is formed on a base material surface by a plasma CVD method wherein an organic metal compound and an oxidizing gas are used as a reactive gas. The vapor deposited film has three sections of a base material side adhesive layer having 5% or more carbon, a barrier intermediate la...