INTERFEROMETRIC ANALYSIS FOR THE MANUFACTURE OF NANO-SCALE DEVICES

The present invention features a system to determine relative spatial parameters between two coordinate systems, which may be a mold and a region of a substrate in which mold is employed to generate a pattern. The system senses relative alignment between the two coordinate systems at multiple points...

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Bibliographic Details
Main Authors SCHUMAKER, Philip, D, RAFFERTY, Tom H, CHOI, Byung-Jin, NIMMAKAYALA, Pawan K, BABBS, Daniel, A, TRUSKETT, Van, N, AGHILI, Alireza
Format Patent
LanguageEnglish
French
German
Published 09.08.2017
Subjects
MEASURING
MEASURING ANGLES
MEASURING AREAS
MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS
PHYSICS
TESTING
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Summary:The present invention features a system to determine relative spatial parameters between two coordinate systems, which may be a mold and a region of a substrate in which mold is employed to generate a pattern. The system senses relative alignment between the two coordinate systems at multiple points and determines relative spatial parameters therebetween. The relative spatial parameters include a relative area and a relative shape.
Bibliography:Application Number: EP20050858633