ULTRA-THIN OHMIC CONTACTS FOR P-TYPE NITRIDE LIGHT EMITTING DEVICES AND METHODS OF FORMING

A flip-chip semiconductor based Light Emitting Device (LED) can include an n-type semiconductor substrate and an n-type GaN epi-layer on the substrate. A p-type GaN epi-layer can be on the n-type GaN epi-layer and a metal ohmic contact p-electrode can be on the p-type GaN epi-layer, where the metal...

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Bibliographic Details
Main Authors HABERERN, KEVIN, BHARATHAN, JAYESH, IBBETSON, JAMES, LI, TING, EMERSON, DAVID, RAFFETTO, MARK, BERGMANN, MICHAEL
Format Patent
LanguageEnglish
French
German
Published 18.03.2015
Subjects
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