Surface mount semiconductor device

• Main Authors: MIYAMURA, SHINICHI, OBA, HAYATO, KAMIKAWA, TOSHIMI
• Format: Patent
• Language: English; French; German
• Published: 26.07.2006
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

A surface mount semiconductor device using a lead frame (1) is provided, which can suppress stress applied to a package by a load in a forming process performed for the lead frame (1) projecting from the package at a portion at which the lead frame (1) projects the package. Concave portions (10) are...