MULTI-LAYER POLISHING PAD MATERIAL FOR CMP

• Main Authors: PRASAD, ABANESHWAR, LACY, MICHAEL, S, SEVILLA, ROLAND, K
• Format: Patent
• Language: English; French; German
• Published: 03.05.2006
• Edition: 7
• Subjects: DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; GRINDING; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; PERFORMING OPERATIONS; POLISHING; TOOLS FOR GRINDING, BUFFING, OR SHARPENING; TRANSPORTING

The invention is directed to a polishing pad for chemical-mechanical polishing comprising an optically transmissive multi-layer polishing pad material, wherein the optically transmissive polishing pad material comprises two or more layers that are joined together without the use of an adhesive.