HARDENABLE PRESSURE SENSITIVE ADHESIVE SHEET FOR DICING/DIE-BONDING AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

• Main Author: SAIKI, NAOYA
• Format: Patent
• Language: English; French; German
• Published: 29.08.2007
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; BASIC ELECTRIC ELEMENTS; CHEMISTRY; DYES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; POLISHES; SEMICONDUCTOR DEVICES; USE OF MATERIALS AS ADHESIVES

The invention provides a dicing and die bonding pressure-sensitive adhesive sheet having a pressure-sensitive adhesive layer that exhibits excellent embedding properties in die bonding and thereby can prevent formation of voids between die pads and the pressure-sensitive adhesive layer even when chips are mounted on the die pads having great difference of height. The dicing and die bonding pressure-sensitive adhesive sheet comprises a base material and a pressure-sensitive adhesive layer disposed thereon, the pressure-sensitive adhesive layer having a ratio (M 100 /M 70 ) of a modulus of elasticity at 100°C (M 100 ) to a modulus of elasticity at 70°C (M 70 ) being 0.5 or less.