PRODUCTION METHODS FOR A SEMICONDUCTOR SUSBTRATE

• Main Authors: SHIONO, ICHIRO, KOUGAMI, HAZUMU, NINOMIYA,MASAHARU
• Format: Patent
• Language: English; French; German
• Published: 16.11.2016
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

A semiconductor substrate manufacturing method has a first layer formation process, a second layer formation process, a heat treatment process, and a polishing process; in the first layer formation process, the thickness of the first SiGe layer is set to less than twice the critical thickness, which...