INDUSTRIAL MICRODEPOSITION SYSTEM INCLUDING MASKING TO REDUCE THE IMPACT OF DROPLET ALIGNMENT AND DROPLET VOLUME TOLERANCES AND ERRORS

• Main Authors: EDWARDS, CHARLES O, ALBERTALLI, DAVID
• Format: Patent
• Language: English; French; German
• Published: 04.01.2012
• Subjects: APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CORRECTION OF TYPOGRAPHICAL ERRORS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; LINING MACHINES; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PERFORMING OPERATIONS; PRINTED CIRCUITS; PRINTING; PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL; SELECTIVE PRINTING MECHANISMS; SPRAYING OR ATOMISING IN GENERAL; STAMPS; TRANSPORTING; TYPEWRITERS

A microdeposition system microdeposits droplets of fluid material to define a feature pattern on a substrate. The feature pattern for the substrate is defined. A mask is created for the feature pattern that reduces a density of defects that occur due to a malfunctioning nozzle of the microdeposition head. The droplets of fluid material are microdeposited onto the substrate based on the mask to define sub-features of the feature pattern. One of the nozzles of the microdeposition head is assigned to each of the sub-features in the feature pattern. The nozzles may be assigned randomly or using other functions. The assigned nozzles in the mask are assigned to one of a plurality of passes of the microdeposition head.