ORGANOSILICATE RESINS AS HARDMASKS FOR ORGANIC POLYMER DIELECTRICS IN THE FABRICATION OF MICROELECTRONIC DEVICES
This invention is a method comprising providing a substrate, forming a first layer on the substrate, wherein the first layer has a dielectric constant of less than 3.0 and comprises an organic polymer, applying an organosilicate resin over the first layer, removing a portion of the organosilicate re...
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Main Authors | , , , , , , , |
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Format | Patent |
Language | English French German |
Published |
28.05.2003
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Edition | 7 |
Subjects | |
Online Access | Get full text |
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Abstract | This invention is a method comprising providing a substrate, forming a first layer on the substrate, wherein the first layer has a dielectric constant of less than 3.0 and comprises an organic polymer, applying an organosilicate resin over the first layer, removing a portion of the organosilicate resin to expose a portion of the first layer, and removing the exposed portions of the first layer. The invention is also an integrated circuit article comprising an active substrate containing transistors and an electrical interconnect structure containing a pattern of metal lines separated, at least partially, by layers or regions of an organic polymeric material having a dielectric constant of less than 3.0 and further comprising a layer of an organosilicate resin above at least one layer of the organic polymer material. |
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AbstractList | This invention is a method comprising providing a substrate, forming a first layer on the substrate, wherein the first layer has a dielectric constant of less than 3.0 and comprises an organic polymer, applying an organosilicate resin over the first layer, removing a portion of the organosilicate resin to expose a portion of the first layer, and removing the exposed portions of the first layer. The invention is also an integrated circuit article comprising an active substrate containing transistors and an electrical interconnect structure containing a pattern of metal lines separated, at least partially, by layers or regions of an organic polymeric material having a dielectric constant of less than 3.0 and further comprising a layer of an organosilicate resin above at least one layer of the organic polymer material. |
Author | HOWARD, KEVIN, E SHAFFER, EDWARD, O., II TOWNSEND, PAUL, H., III MILLS, LYNNE, K GOMBAR-FETNER, SHEILA HETZNER, JACK, E WAETERLOOS, JOOST, J., M WILSON, LARRY, R |
Author_xml | – fullname: HETZNER, JACK, E – fullname: TOWNSEND, PAUL, H., III – fullname: MILLS, LYNNE, K – fullname: GOMBAR-FETNER, SHEILA – fullname: SHAFFER, EDWARD, O., II – fullname: WILSON, LARRY, R – fullname: HOWARD, KEVIN, E – fullname: WAETERLOOS, JOOST, J., M |
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DocumentTitleAlternate | RESINES ORGANOSILICATE UTILISEES COMME MASQUES DURS POUR DES POLYMERES DIELECTRIQUES ORGANIQUES DANS LA FABRICATION DE DISPOSITIFS MICRO-ELECTRONIQUES ORGANOSILIKATHARZ-HART-MASKE FÜR POLYMERE IN DER HERSTELLUNG VON MIKROELEKTRONISCHEN SCHALTUNGEN |
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RelatedCompanies | DOW GLOBAL TECHNOLOGIES INC |
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Snippet | This invention is a method comprising providing a substrate, forming a first layer on the substrate, wherein the first layer has a dielectric constant of less... |
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SubjectTerms | APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CHEMISTRY CINEMATOGRAPHY COMPOSITIONS BASED THEREON ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MATERIALS THEREFOR METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP |
Title | ORGANOSILICATE RESINS AS HARDMASKS FOR ORGANIC POLYMER DIELECTRICS IN THE FABRICATION OF MICROELECTRONIC DEVICES |
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