Method of mounting electronic parts with Sn-Zn solder free of Pb

• Main Authors: TANAKA, AKIHIRO, SAKAI, HIROSHI, SUZUKI, MOTOJI, IGARASHI, MAKOTO
• Format: Patent
• Language: English; French; German
• Published: 15.09.2004
• Edition: 7
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACHINE TOOLS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM

There is disclosed a method of mounting electronic parts with Sn - Zn solder which is Pb-free solder without a reduction in the bonding strength. A printed circuit board for mounting electronic parts with Pb-free solder comprises a printed circuit board whose surface is treated with Ni/Au, having an...