Soldered joint and method for producing a soldered joint

The arrangement uses a solder material that is introduced between the joint partners or parts. At least one joint partner (1) has a solder reservoir (3) opening near the contact surface (7), facing the contact surface and into which solder is introduced. The solder reservoir is fully bounded and enc...

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Bibliographic Details
Main Authors STENGELE, JOERG, NAGLER, CHRISTOPH, BENEDETTI, BRUNO
Format Patent
LanguageEnglish
French
German
Published 24.03.2010
Subjects
CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
PERFORMING OPERATIONS
SOLDERING OR UNSOLDERING
TRANSPORTING
WELDING
WORKING BY LASER BEAM
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Summary:The arrangement uses a solder material that is introduced between the joint partners or parts. At least one joint partner (1) has a solder reservoir (3) opening near the contact surface (7), facing the contact surface and into which solder is introduced. The solder reservoir is fully bounded and enclosed by the contact surface. AN Independent claim is also included for the following: a method of making a solder joint between two elements with a common contact surface.
Bibliography:Application Number: EP20020405366