VISCOSITY MODIFIER FOR THERMOSETTING RESIN COMPOSITION

A heat curable thermosetting epoxy resin formulation useful for making prepregs and electrical laminates containing a viscosity modifier, wherein the viscosity modifier is:(a) an optionally substituted polymer of a monovinylidene aromatic monomer, optionally having one or more further unsaturated mo...

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Bibliographic Details
Main Author GAN, Joseph
Format Patent
LanguageEnglish
French
German
Published 21.12.2016
Subjects
AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
GENERAL PROCESSES OF COMPOUNDING
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
THEIR PREPARATION OR CHEMICAL WORKING-UP
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
WORKING-UP
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Abstract A heat curable thermosetting epoxy resin formulation useful for making prepregs and electrical laminates containing a viscosity modifier, wherein the viscosity modifier is:(a) an optionally substituted polymer of a monovinylidene aromatic monomer, optionally having one or more further unsaturated monomers copolymerized therewith;(b) an optionally substituted polyphenylene oxide; or(c) an oxazolidone ring-containing compound.
AbstractList A heat curable thermosetting epoxy resin formulation useful for making prepregs and electrical laminates containing a viscosity modifier, wherein the viscosity modifier is:(a) an optionally substituted polymer of a monovinylidene aromatic monomer, optionally having one or more further unsaturated monomers copolymerized therewith;(b) an optionally substituted polyphenylene oxide; or(c) an oxazolidone ring-containing compound.
Author GAN, Joseph
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DocumentTitleAlternate AGENT MODIFIANT LA VISCOSITE UTILISE DANS UNE COMPOSITION DE RESINE THERMODURCISSABLE
VISKOSITÄTSMODIFIZIERUNGSMITTEL FÜR EINE WÄRMEHÄRTENDE HARZZUSAMMENSETZUNG
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Snippet A heat curable thermosetting epoxy resin formulation useful for making prepregs and electrical laminates containing a viscosity modifier, wherein the viscosity...
SourceID epo
SourceType Open Access Repository
SubjectTerms AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
GENERAL PROCESSES OF COMPOUNDING
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
THEIR PREPARATION OR CHEMICAL WORKING-UP
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
WORKING-UP
Title VISCOSITY MODIFIER FOR THERMOSETTING RESIN COMPOSITION
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