Desiccation of moisture-sensitive electronic devices

A method of desiccating an environment surrounding a moisture-sensitive electronic device sealed within an enclosure, includes selecting a desiccant comprised of solid particles having a particle size range 0.1 to 200 micrometers, the desiccant selected to provide an equilibrium minimum humidity lev...

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Main Authors SERBICKI, JEFFREY PETER, BOROSON, MICHAEL LOUIS, BESSEY, PETER G
Format Patent
LanguageEnglish
French
German
Published 18.10.2006
Edition7
Subjects
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Abstract A method of desiccating an environment surrounding a moisture-sensitive electronic device sealed within an enclosure, includes selecting a desiccant comprised of solid particles having a particle size range 0.1 to 200 micrometers, the desiccant selected to provide an equilibrium minimum humidity level lower than a humidity level to which the device is sensitive within the sealed enclosure; choosing a binder that maintains or enhances the moisture absorption rate of the desiccant for blending the selected desiccant therein, the binder being in liquid phase or dissolved in a liquid; forming a castable blend including at least the desiccant particles and the binder, the blend having a preferred weight fraction of the desiccant particles in the blend in a range of 10% to 90%; casting a measured amount of the blend onto a portion of an interior surface of an enclosure to form a desiccant layer thereover, the enclosure having a sealing flange; solidifying the desiccant layer to a solid; and sealing the electronic device with the enclosure along the sealing flange.
AbstractList A method of desiccating an environment surrounding a moisture-sensitive electronic device sealed within an enclosure, includes selecting a desiccant comprised of solid particles having a particle size range 0.1 to 200 micrometers, the desiccant selected to provide an equilibrium minimum humidity level lower than a humidity level to which the device is sensitive within the sealed enclosure; choosing a binder that maintains or enhances the moisture absorption rate of the desiccant for blending the selected desiccant therein, the binder being in liquid phase or dissolved in a liquid; forming a castable blend including at least the desiccant particles and the binder, the blend having a preferred weight fraction of the desiccant particles in the blend in a range of 10% to 90%; casting a measured amount of the blend onto a portion of an interior surface of an enclosure to form a desiccant layer thereover, the enclosure having a sealing flange; solidifying the desiccant layer to a solid; and sealing the electronic device with the enclosure along the sealing flange.
Author BOROSON, MICHAEL LOUIS
SERBICKI, JEFFREY PETER
BESSEY, PETER G
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DocumentTitleAlternate Desikkation von feuchtigkeitsempfindlichen elektronischen Geräten
Dessiccation de dispositifs électroniques sensibles a l'humidité
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Snippet A method of desiccating an environment surrounding a moisture-sensitive electronic device sealed within an enclosure, includes selecting a desiccant comprised...
SourceID epo
SourceType Open Access Repository
SubjectTerms ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR
BASIC ELECTRIC ELEMENTS
BLASTING
CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS,e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES,DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS
CONVEYING
DRYING
DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
HANDLING THIN OR FILAMENTARY MATERIAL
HEATING
LIGHTING
MECHANICAL ENGINEERING
PACKAGES
PACKAGING ELEMENTS
PACKING
PERFORMING OPERATIONS
PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
SEMICONDUCTOR DEVICES
SEPARATION
STORING
TRANSPORTING
WEAPONS
Title Desiccation of moisture-sensitive electronic devices
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