Surface acoustic wave device
An object of the present invention is to provide a filter that enables to manufacture in a multi-chip package with ease and that is of small size and multi-function or multi-mode. In a constitution of the present invention, a filter comprises a package comprising a base on one main surface thereof a...
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| Main Authors | , |
|---|---|
| Format | Patent |
| Language | English French German |
| Published |
08.05.2002
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| Edition | 7 |
| Subjects | |
| Online Access | Get full text |
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| Abstract | An object of the present invention is to provide a filter that enables to manufacture in a multi-chip package with ease and that is of small size and multi-function or multi-mode. In a constitution of the present invention, a filter comprises a package comprising a base on one main surface thereof a conductor is formed, and a plurality of surface acoustic wave chips comprising a plurality of interdigital transducers formed on one main surface of a piezoelectric substrate, signal terminals disposed on facing sides on the piezoelectric substrate, and ground terminals disposed on the piezoelectric substrate. Here, the plurality of surface acoustic wave chips, at the signal terminals and the ground terminals, is bonded to the conductor in a face down way. |
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| AbstractList | An object of the present invention is to provide a filter that enables to manufacture in a multi-chip package with ease and that is of small size and multi-function or multi-mode. In a constitution of the present invention, a filter comprises a package comprising a base on one main surface thereof a conductor is formed, and a plurality of surface acoustic wave chips comprising a plurality of interdigital transducers formed on one main surface of a piezoelectric substrate, signal terminals disposed on facing sides on the piezoelectric substrate, and ground terminals disposed on the piezoelectric substrate. Here, the plurality of surface acoustic wave chips, at the signal terminals and the ground terminals, is bonded to the conductor in a face down way. |
| Author | KURODA, YASUSHI KAWASE, MINORU |
| Author_xml | – fullname: KURODA, YASUSHI – fullname: KAWASE, MINORU |
| BookMark | eNrjYmDJy89L5WSQCS4tSktMTlVITM4vLS7JTFYoTyxLVUhJLctMTuVhYE1LzClO5YXS3AwKbq4hzh66qQX58anFBUB9eakl8a4BhgaG5oZmlo7GxkQoAQAlyiUG |
| ContentType | Patent |
| DBID | EVB |
| DatabaseName | esp@cenet |
| DatabaseTitleList | |
| Database_xml | – sequence: 1 dbid: EVB name: esp@cenet url: http://worldwide.espacenet.com/singleLineSearch?locale=en_EP sourceTypes: Open Access Repository |
| DeliveryMethod | fulltext_linktorsrc |
| Discipline | Medicine Chemistry Sciences |
| DocumentTitleAlternate | Dispositif à ondes acoustiques de surface Akustische Oberflächenwellenanordnung |
| Edition | 7 |
| ExternalDocumentID | EP1017169A3 |
| GroupedDBID | EVB |
| ID | FETCH-epo_espacenet_EP1017169A33 |
| IEDL.DBID | EVB |
| IngestDate | Fri Jul 19 16:06:39 EDT 2024 |
| IsOpenAccess | true |
| IsPeerReviewed | false |
| IsScholarly | false |
| Language | English French German |
| LinkModel | DirectLink |
| MergedId | FETCHMERGED-epo_espacenet_EP1017169A33 |
| Notes | Application Number: EP19990125997 |
| OpenAccessLink | https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20020508&DB=EPODOC&CC=EP&NR=1017169A3 |
| ParticipantIDs | epo_espacenet_EP1017169A3 |
| PublicationCentury | 2000 |
| PublicationDate | 20020508 |
| PublicationDateYYYYMMDD | 2002-05-08 |
| PublicationDate_xml | – month: 05 year: 2002 text: 20020508 day: 08 |
| PublicationDecade | 2000 |
| PublicationYear | 2002 |
| RelatedCompanies | KABUSHIKI KAISHA TOSHIBA |
| RelatedCompanies_xml | – name: KABUSHIKI KAISHA TOSHIBA |
| Score | 2.548717 |
| Snippet | An object of the present invention is to provide a filter that enables to manufacture in a multi-chip package with ease and that is of small size and... |
| SourceID | epo |
| SourceType | Open Access Repository |
| SubjectTerms | BASIC ELECTRONIC CIRCUITRY ELECTRICITY IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS RESONATORS |
| Title | Surface acoustic wave device |
| URI | https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20020508&DB=EPODOC&locale=&CC=EP&NR=1017169A3 |
| hasFullText | 1 |
| inHoldings | 1 |
| isFullTextHit | |
| isPrint | |
| link | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwY2BQMUo2NjNPNUrSTQYW_7omyRYGupagVRYmiZbAytbAMtnUFLTB2dfPzCPUxCvCNIKJIRO2FwZ8Tmg5-HBEYI5KBub3EnB5XYAYxHIBr60s1k_KBArl27uF2LqowXrHRgbABoeai5Ota4C_i7-zmrMzkKXmF2RrCDkXxtGYmYEV2Io2B63-cg1zAm1KKUCuUdwEGdgCgIbllQgxMKXmCTNwOsMuXhNm4PCFzncDmdCsVyzCIBNcWpQGdKoCsAgD38ClUJ5YlqqQkgrK6qIMCm6uIc4eukBr4uFeincNgDvIWIyBBdjTT5VgUEhMSU0yMTZITDE0TjUxNDdOSjaxTDFLNk0zMDZOTjIylGSQxGmMFB45aQYu8CUmoHV6FjIMLCVFpamywLq0JEkOHAoAZEt3LQ |
| link.rule.ids | 230,309,783,888,25578,76884 |
| linkProvider | European Patent Office |
| linkToHtml | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV3NT8IwFH9BNOJNUQOKuoPZbXFbt7EdFiP7yFQ2Fp2GG1m7knBBAkP-fd8qQy96a9rk9bXJ-2rf-z2AW50Rq891qjBU_4rBbFVxqiwLI3fQ2KoOM82qwDlOrOjNeBqb4wbM6loYgRO6EeCIKFEM5b0U-nrx84jli9zK1R2d4dTHfZi5vlxHx7qKDofsD9wgHfkjT_Y8HMnJi6t948I8kD3YRw_brmD2g_dBVZSy-G1RwmM4SJHYvDyBBp-3oeXVjdfacBhv_7txuBW91Sn0XtfLKbIqoQoTHbikTf7JpYJXon4GUhhkXqTgNpPdkSZBumOInEMTI33eASkvODWImhca4YbWJ5QZTmExc6oSwqiudaH7J5mLf9ZuoBVl8XAyfEyeL-FINDSpcvbsHjTL5ZpfoV0t6bW4kS8iL3od |
| openUrl | ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Apatent&rft.title=Surface+acoustic+wave+device&rft.inventor=KURODA%2C+YASUSHI&rft.inventor=KAWASE%2C+MINORU&rft.date=2002-05-08&rft.externalDBID=A3&rft.externalDocID=EP1017169A3 |