Solder bonding printed circuit board
The specification describes techniques for attaching double sided circuit boards having plated through holes to interconnection substrates using solder bump arrays. The through holes are filled with a high melting point solder which allows solder bumps to be located directly on the through hole thus...
Saved in:
Main Authors | , |
---|---|
Format | Patent |
Language | English French German |
Published |
15.09.1999
|
Edition | 6 |
Subjects | |
Online Access | Get full text |
Cover
Loading…
Be the first to leave a comment!