Method of producing flexible printed-circuit board covered with cover layer

A flexible printed-circuit board covered with a cover layer is produced by bonding (a) a flexible printed-circuit board that comprises a flexible base having a surface bearing a circuit and (b) a polyimide film having a surface treated to increase adhering property and another surface not treated to...

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Main Authors NAGAO, KOUICHI, SUZUKI, MASAKATSU, NOMURA, HIROSHI, IMAIZUMI, JUNICHI, OTI, TAKATO, SATOU, EIKICHI, KATOH, YASUSHI
Format Patent
LanguageEnglish
French
German
Published 10.06.1992
Subjects
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Abstract A flexible printed-circuit board covered with a cover layer is produced by bonding (a) a flexible printed-circuit board that comprises a flexible base having a surface bearing a circuit and (b) a polyimide film having a surface treated to increase adhering property and another surface not treated to increase adhering property, each of the surfaces being coated with an adhesive layer, with the adhesive layer on the surface treated to increase adhering property interposed between the polyimide film and the surface bearing the circuit, and then peeling off the adhesive layer coating the polyimide film on the surface not treated to increase adhering property.
AbstractList A flexible printed-circuit board covered with a cover layer is produced by bonding (a) a flexible printed-circuit board that comprises a flexible base having a surface bearing a circuit and (b) a polyimide film having a surface treated to increase adhering property and another surface not treated to increase adhering property, each of the surfaces being coated with an adhesive layer, with the adhesive layer on the surface treated to increase adhering property interposed between the polyimide film and the surface bearing the circuit, and then peeling off the adhesive layer coating the polyimide film on the surface not treated to increase adhering property.
Author NOMURA, HIROSHI
KATOH, YASUSHI
NAGAO, KOUICHI
SATOU, EIKICHI
SUZUKI, MASAKATSU
IMAIZUMI, JUNICHI
OTI, TAKATO
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– fullname: SATOU, EIKICHI
– fullname: KATOH, YASUSHI
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DocumentTitleAlternate Procédé de fabrication d'un plaquette à circuit flexible recouverte d'une couche de recouvrement.
Verfahren zur Herstellung von einer mit einer Deckschicht überzogenen biegsamen Leiterplatte.
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Snippet A flexible printed-circuit board covered with a cover layer is produced by bonding (a) a flexible printed-circuit board that comprises a flexible base having a...
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SourceType Open Access Repository
SubjectTerms ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G
BASIC ELECTRIC ELEMENTS
CABLES
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CHEMISTRY
COMPOSITIONS BASED THEREON
CONDUCTORS
DYES
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
GENERAL PROCESSES OF COMPOUNDING
INSULATORS
LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
ORGANIC MACROMOLECULAR COMPOUNDS
PAINTS
PERFORMING OPERATIONS
POLISHES
PRINTED CIRCUITS
SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES
THEIR PREPARATION OR CHEMICAL WORKING-UP
TRANSPORTING
USE OF MATERIALS AS ADHESIVES
WORKING-UP
Title Method of producing flexible printed-circuit board covered with cover layer
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