COMPOSITION AND COATING TO PREVENT CURRENT INDUCED ELECTRO-CHEMICAL DENDRITE FORMATION BETWEEN CONDUCTORS ON DIELECTRIC SUBSTRATE
The present invention comprises the use of a copper/ nickel containing alloy composition or application of a protective nickel alloy coating to copper current-carrying leads to prevent electrolytic migration between tape automated bonding (TAB) package leads. One embodiment of the invention comprise...
Saved in:
Main Authors | , , , |
---|---|
Format | Patent |
Language | English |
Published |
04.03.1992
|
Edition | 5 |
Subjects | |
Online Access | Get full text |
Cover
Loading…
Abstract | The present invention comprises the use of a copper/ nickel containing alloy composition or application of a protective nickel alloy coating to copper current-carrying leads to prevent electrolytic migration between tape automated bonding (TAB) package leads. One embodiment of the invention comprises a substrate having adhered thereon a plurality of nickel-copper alloy current-carrying leads. Option-lly, an intermediate adhesion promoting layer is located between the substrate and the leads. Another embodiment relates to electronic circuit packages comprising a substrate (11) and copper current-carrying leads (13) wherein the exposed area of the copper current-carrying leads is overplated with a more durable metal, such as a noble metal (14), to thereby enhance the circuits' corrosion resistance, solderability and bondability. This durable metal layer is in turn plated with a nickel-containing barrier layer (15). By virtue of the alloy composition or the protective coating materials applied to the copper current-carrying leads in accordance with the present invention, electrolytic migration can be substantially reduced or eliminated. |
---|---|
AbstractList | The present invention comprises the use of a copper/ nickel containing alloy composition or application of a protective nickel alloy coating to copper current-carrying leads to prevent electrolytic migration between tape automated bonding (TAB) package leads. One embodiment of the invention comprises a substrate having adhered thereon a plurality of nickel-copper alloy current-carrying leads. Option-lly, an intermediate adhesion promoting layer is located between the substrate and the leads. Another embodiment relates to electronic circuit packages comprising a substrate (11) and copper current-carrying leads (13) wherein the exposed area of the copper current-carrying leads is overplated with a more durable metal, such as a noble metal (14), to thereby enhance the circuits' corrosion resistance, solderability and bondability. This durable metal layer is in turn plated with a nickel-containing barrier layer (15). By virtue of the alloy composition or the protective coating materials applied to the copper current-carrying leads in accordance with the present invention, electrolytic migration can be substantially reduced or eliminated. |
Author | PALMER, MICHAEL JON NOYAN, ISMAIL CEVDET BREWER, WILLIAM DEAN HORTON, RAYMOND ROBERT |
Author_xml | – fullname: BREWER, WILLIAM DEAN – fullname: NOYAN, ISMAIL CEVDET – fullname: HORTON, RAYMOND ROBERT – fullname: PALMER, MICHAEL JON |
BookMark | eNqNjE0OgjAQRrvQhX93mAuQSCDuy3SQJtCSdtAlIaauDJDgBby5oB7A1Uu-fO9txaof-rARL7RVbb1mbQ1IowCtZG3OwBZqRxcyDNg4t1Ab1SApoJKQnY2woEqjLEGRUU4zQW5dJT-pjPhKZObcIrF1HuZV6a-rEXyTeXaSaS_W9-4xhcOPOwE5MRZRGIc2TGN3C314tlQf0zSOT6lMkj8ub_WvPjs |
ContentType | Patent |
DBID | EVB |
DatabaseName | esp@cenet |
DatabaseTitleList | |
Database_xml | – sequence: 1 dbid: EVB name: esp@cenet url: http://worldwide.espacenet.com/singleLineSearch?locale=en_EP sourceTypes: Open Access Repository |
DeliveryMethod | fulltext_linktorsrc |
Discipline | Medicine Chemistry Sciences |
Edition | 5 |
ExternalDocumentID | EP0441164A3 |
GroupedDBID | EVB |
ID | FETCH-epo_espacenet_EP0441164A33 |
IEDL.DBID | EVB |
IngestDate | Fri Jul 19 15:14:51 EDT 2024 |
IsOpenAccess | true |
IsPeerReviewed | false |
IsScholarly | false |
Language | English |
LinkModel | DirectLink |
MergedId | FETCHMERGED-epo_espacenet_EP0441164A33 |
Notes | Application Number: EP19910100743 |
OpenAccessLink | https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19920304&DB=EPODOC&CC=EP&NR=0441164A3 |
ParticipantIDs | epo_espacenet_EP0441164A3 |
PublicationCentury | 1900 |
PublicationDate | 19920304 |
PublicationDateYYYYMMDD | 1992-03-04 |
PublicationDate_xml | – month: 03 year: 1992 text: 19920304 day: 04 |
PublicationDecade | 1990 |
PublicationYear | 1992 |
RelatedCompanies | INTERNATIONAL BUSINESS MACHINES CORPORATION |
RelatedCompanies_xml | – name: INTERNATIONAL BUSINESS MACHINES CORPORATION |
Score | 2.418173 |
Snippet | The present invention comprises the use of a copper/ nickel containing alloy composition or application of a protective nickel alloy coating to copper... |
SourceID | epo |
SourceType | Open Access Repository |
SubjectTerms | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
Title | COMPOSITION AND COATING TO PREVENT CURRENT INDUCED ELECTRO-CHEMICAL DENDRITE FORMATION BETWEEN CONDUCTORS ON DIELECTRIC SUBSTRATE |
URI | https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19920304&DB=EPODOC&locale=&CC=EP&NR=0441164A3 |
hasFullText | 1 |
inHoldings | 1 |
isFullTextHit | |
isPrint | |
link | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfR1NT8IwtEE06k1RI36lB7PbItAx2YEY1haZce0yOuRm9kXCZRCZ8ew_93UCetFTmzZ9yXvp6_t-Rei2206z2LbaZmyTzLSS2DGdPG2ZnZlDZl0yAxGk6519YY8i62nandbQfFMLU_UJ_aiaIwJHpcDvZfVeL3-cWKzKrVzdJXNYWjwMVZ8Z2bpcrKMjfQZz-zyQTFKDUpgZIuy3QOyDZTAgO2hXa9G6zT6fuLooZflbogyP0F4AwIryGNXyooEO6ObjtQba99fxbpiuWW91gj6p9AM59rRLCQ8Ew1QOlCcesZIYyDjhQmEahaEePcEiyhnmz5yqUJqbvgeYccFCeKww2H5-5Z3CLlcvnAsApw8pGY4xrIKWWJ31KB5Hrv5YWfFThIdc0ZEJuLxu6fbKgy3W5AzVi0WRnyNM7mO4PanVSzNi5e3MaaWg9NgJ8H7Ss6y4iZp_grn4Z-8SHX6nshKzZV2hevn2nl-DwC6Tm4rUX2SzkS0 |
link.rule.ids | 230,309,786,891,25594,76904 |
linkProvider | European Patent Office |
linkToHtml | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfR1NT8IwtEE04k1RI372YHZbHGwMdiCGtUWmrF1Gh9zIvki4DCIznv3nvk1AL3pq06YveS99fd-vCN23m3ESmkZTDU09UY0otFQrjTW1Nbf0eVufgwgq6p1dbg4D43nanlbQYlsLU_YJ_SibIwJHxcDvefler36cWLTMrVw_RAtYWj4OZI8qyaZcrFVE-hRq95gnqCAKITBTuN_TQOyDZdDX99B-ByzCos0-m9hFUcrqt0QZHKMDD4Bl-QmqpFkd1cj247U6OnQ38W6YblhvfYo-iXA9MXYKlxLuc4qJ6EuHP2EpMJBxwrjEJPD9YnQ4DQijmI0Ykb5Qt30PMGWc-vBYYbD93NI7hW0mXxnjAK44JIU_xrAKWmJ51iF4HNjFx8qSnSE8YJIMVcBltqPbjHk7rPVzVM2WWXqBsN4J4fbERjdOdCNtJpYWg9JjRsD7UdcwwgZq_Anm8p-9O1QbSnc0Gzn85Qodfae16qpmXKNq_vae3oDwzqPbkuxfVQKUGA |
openUrl | ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Apatent&rft.title=COMPOSITION+AND+COATING+TO+PREVENT+CURRENT+INDUCED+ELECTRO-CHEMICAL+DENDRITE+FORMATION+BETWEEN+CONDUCTORS+ON+DIELECTRIC+SUBSTRATE&rft.inventor=BREWER%2C+WILLIAM+DEAN&rft.inventor=NOYAN%2C+ISMAIL+CEVDET&rft.inventor=HORTON%2C+RAYMOND+ROBERT&rft.inventor=PALMER%2C+MICHAEL+JON&rft.date=1992-03-04&rft.externalDBID=A3&rft.externalDocID=EP0441164A3 |