Composition and coating to prevent current induced electro-chemical dendrite formation between conductors on dielectric substrate

• Main Authors: BREWER, WILLIAM DEAN, NOYAN, ISMAIL CEVDET, HORTON, RAYMOND ROBERT, PALMER, MICHAEL JON
• Format: Patent
• Language: English; French; German
• Published: 14.08.1991
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

The present invention comprises the use of a copper/ nickel containing alloy composition or application of a protective nickel alloy coating to copper current-carrying leads to prevent electrolytic migration between tape automated bonding (TAB) package leads. One embodiment of the invention comprise...