Non-aqueous process for delineating patterns on high temperature superconductor films

• Main Authors: MYROSZNYK, JAMES M, RAY, MICHAEL, SHOTT, CRAIG A
• Format: Patent
• Language: English; French; German
• Published: 08.05.1991
• Subjects: APPARATUS SPECIALLY ADAPTED THEREFOR; CINEMATOGRAPHY; ELECTRICITY; ELECTROGRAPHY; HOLOGRAPHY; MATERIALS THEREFOR; ORIGINALS THEREFOR; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS

A method delineates a pattern upon a surface, such as a surface of HTS material, without exposing the surface to an aqueous based solution. The method includes the steps of forming a first layer over the surface, the first layer being comprised of a first photoresist selected to be impervious to water such as a type of poly-methacrylate resist. A second layer is formed over the first layer, the second layer being comprised of a second photoresist such as a conventional AZ-type positive photoresist. The first and the second layers are processed to remove portions of the first and the second layers to uncover a desired portion of the surface. Processing of the second photoresist layer with conventional aqueous-based solutions does not adversely affect the surface because of the intervening layer of water impervious photoresist. The surface is next processed by ion milling to delineate the surface or is processed by depositing a layer of metalization over at least the uncovered and previously delineated portion of the surface. Finally, there is performed a step of removing the first and second layers with a non-aqueous solvent, thereby also lifting off any metal deposited upon the second photoresist layer.