Novel photosensitive resin compositions

A novel photosensitive resin composition, which has fairly high sensitivity to light and developable with water comprising of essential components a resin represented by the general formula (I), wherein X, which may be present or absent, represents an organic acid when it is present, Y stands for a...

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Bibliographic Details
Main Authors SHIMIZU, KIYOSHI, SERIZAWA, HAJIME, OJIMA, KOICHI
Format Patent
LanguageEnglish
French
German
Published 04.01.1989
Subjects
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Summary:A novel photosensitive resin composition, which has fairly high sensitivity to light and developable with water comprising of essential components a resin represented by the general formula (I), wherein X, which may be present or absent, represents an organic acid when it is present, Y stands for a group containing carbon-carbon double bond(s) represented by the formula (II) or (III), -OCH2CH=CH [III] n is an integer of 10 or greater, j is a number defined as 0 < j < 1, and t is 0 or 1, and a sodium or potassium salt of 4,4'-diazidostilbene-2,2'-disulfonic acid represented by the general formula (IV), wherein z stands for sodium atom or potassium atom; or the resin represented by the general formula (I), the sodium or potassium salt of 4,4'-diazidostilbene-2,2'-disulfonic acid represented by the general formula (IV), and an aromatic ketone represented by the general formula (V), wherein G stands for hydrogen atom or an amino group or dialkylamino group represented by the general formula (VI), where u is 0, 1 or 2. o
Bibliography:Application Number: EP19870109403