Process for forming a protective coating on integrated circuit devices
A protective coating is formed on an integrated circuit device by coating the device with a solution of acetylene terminated, branched polyphenylene prepolymer material and heating the material to form a thermoset crosslinked polymer layer. Selectively patterned portions may be provided when, after...
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Main Authors | , , |
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Format | Patent |
Language | English French German |
Published |
05.01.1983
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Subjects | |
Online Access | Get full text |
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