Process for forming a protective coating on integrated circuit devices

A protective coating is formed on an integrated circuit device by coating the device with a solution of acetylene terminated, branched polyphenylene prepolymer material and heating the material to form a thermoset crosslinked polymer layer. Selectively patterned portions may be provided when, after...

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Bibliographic Details
Main Authors BAISE, ARNOLD IVAN, WU, ANTHONY WAI, CZORNYJ, GEORGE
Format Patent
LanguageEnglish
French
German
Published 05.01.1983
Subjects
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