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A radiation sensitive resin composition which can be suitably used as a negative type resist having a high sensitivity, a high resolution, a high yield of residual film thickness and high thermal resistance, and which comprises (A) an alkali-soluble novolak resin, (B) a phenolic compound having a st...

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Bibliographic Details
Main Authors OTA, TOSHIYUKI, YOKKAICHI-SHI, JP, INOUE, MASAAKI, SUZUKA-SHI, JP, SHIRAKI, SHINJI, YOKKAICHI-SHI, JP, MIYAMOTO, HIDETOSHI, YOKKAICHI-SHI, JP, YUMOTO, YOSHIJI, YOKKAICHI-SHI, JP, MIURA, TAKAO, YOKKAICHI-SHI, JP
Format Patent
LanguageGerman
Published 30.04.1997
Edition6
Subjects
APPARATUS SPECIALLY ADAPTED THEREFOR
CINEMATOGRAPHY
ELECTROGRAPHY
HOLOGRAPHY
MATERIALS THEREFOR
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
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Summary:A radiation sensitive resin composition which can be suitably used as a negative type resist having a high sensitivity, a high resolution, a high yield of residual film thickness and high thermal resistance, and which comprises (A) an alkali-soluble novolak resin, (B) a phenolic compound having a standard polystyrene-reduced weight average molecular weight of 10,000 or less such as polyvinylphenol, (C) a compound capable of cross-linking the component (A) and/or the component (B) in the presence of an acid, and (D) a radiation sensitive acid generator such as a triazine compound having a halomethyl group.
Bibliography:Application Number: DE19946000595T