Element zum Einkoppeln von elektrischer Energie in eine Bearbeitungskammer und Bearbeitungssystem mit einem solchen Element

A processing system (12) for processing a substrate (18) with a plasma (28) comprises a processing chamber (13) defining a processing space (14) and including a substrate support (17) therein for supporting a substrate (18) in the processing space (14) and a gas inlet (20) for introducing a process...

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Main Authors BRCKA, JOSEF, CONSOLI, PAUL LOUIS
Format Patent
LanguageGerman
Published 02.01.2009
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Abstract A processing system (12) for processing a substrate (18) with a plasma (28) comprises a processing chamber (13) defining a processing space (14) and including a substrate support (17) therein for supporting a substrate (18) in the processing space (14) and a gas inlet (20) for introducing a process gas into said processing space (14). A plasma source is operable for creating a plasma (28) in the processing space (14) from process gas introduced therein. The plasma source comprises a dielectric window (24a) which interfaces with the processing chamber (12) proximate the processing space (14) and an inductive element (10) positioned outside of the chamber (12) and proximate the dielectric window (24a). The inductive element (10) is operable for coupling electrical energy through the dielectric window (24a) and into the processing space (14) to create a plasma (28) therein and comprises a variety of alternative designs for providing a dense, uniform plasma.
AbstractList A processing system (12) for processing a substrate (18) with a plasma (28) comprises a processing chamber (13) defining a processing space (14) and including a substrate support (17) therein for supporting a substrate (18) in the processing space (14) and a gas inlet (20) for introducing a process gas into said processing space (14). A plasma source is operable for creating a plasma (28) in the processing space (14) from process gas introduced therein. The plasma source comprises a dielectric window (24a) which interfaces with the processing chamber (12) proximate the processing space (14) and an inductive element (10) positioned outside of the chamber (12) and proximate the dielectric window (24a). The inductive element (10) is operable for coupling electrical energy through the dielectric window (24a) and into the processing space (14) to create a plasma (28) therein and comprises a variety of alternative designs for providing a dense, uniform plasma.
Author CONSOLI, PAUL LOUIS
BRCKA, JOSEF
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Snippet A processing system (12) for processing a substrate (18) with a plasma (28) comprises a processing chamber (13) defining a processing space (14) and including...
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SubjectTerms BASIC ELECTRIC ELEMENTS
CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOIDCHEMISTRY
CHEMICAL SURFACE TREATMENT
CHEMISTRY
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING MATERIAL WITH METALLIC MATERIAL
COATING METALLIC MATERIAL
DIFFUSION TREATMENT OF METALLIC MATERIAL
ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL
METALLURGY
PERFORMING OPERATIONS
PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
PLASMA TECHNIQUE
PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OFNEUTRONS
PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMICBEAMS
SEMICONDUCTOR DEVICES
SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
THEIR RELEVANT APPARATUS
TRANSPORTING
Title Element zum Einkoppeln von elektrischer Energie in eine Bearbeitungskammer und Bearbeitungssystem mit einem solchen Element
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