Method for soldering electric components to PCB

Electric components (2) are soldered to a circuit board (1) by means of a vapour (21) which is produced from a liquid (20) in a vapour generator (4), and whose boiling point is above the soldering temperature applied to the soldering region via a pipe (5).A pump (7) delivers the medium (21) to a hea...

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Bibliographic Details
Main Author ZINN, WINFRIED., 7519 GONDELSHEIM
Format Patent
LanguageEnglish
German
Published 23.06.1994
Edition5
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MACHINE TOOLS
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
PERFORMING OPERATIONS
PRINTED CIRCUITS
SOLDERING OR UNSOLDERING
TRANSPORTING
WELDING
WORKING BY LASER BEAM
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Summary:Electric components (2) are soldered to a circuit board (1) by means of a vapour (21) which is produced from a liquid (20) in a vapour generator (4), and whose boiling point is above the soldering temperature applied to the soldering region via a pipe (5).A pump (7) delivers the medium (21) to a heating nozzle which is directed to a limited region on one side of the circuit board for a limited time interval.
Bibliography:Application Number: DE19924243385