Method for soldering electric components to PCB
Electric components (2) are soldered to a circuit board (1) by means of a vapour (21) which is produced from a liquid (20) in a vapour generator (4), and whose boiling point is above the soldering temperature applied to the soldering region via a pipe (5).A pump (7) delivers the medium (21) to a hea...
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Main Author | |
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Format | Patent |
Language | English German |
Published |
23.06.1994
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Edition | 5 |
Subjects | |
Online Access | Get full text |
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Summary: | Electric components (2) are soldered to a circuit board (1) by means of a vapour (21) which is produced from a liquid (20) in a vapour generator (4), and whose boiling point is above the soldering temperature applied to the soldering region via a pipe (5).A pump (7) delivers the medium (21) to a heating nozzle which is directed to a limited region on one side of the circuit board for a limited time interval. |
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Bibliography: | Application Number: DE19924243385 |